PCB R&D & Prototyping Equipment

Universal BGA Precision Direct Component Printing & Ball Attach

MY-207722-A US-2024/0238888 A1

The Innovation-Led Approach.

In collaboration with Jabil MTI Asia, advancing connector interposer technology for next-generation supercomputers.
High-Stiffness Material with Vibration Damping. Crafted for uncompromising precision, this ultra-rigid, perfectly straight material features exceptional vibration-damping performance—efficiently dissipating energy and neutralizing ambient vibrations to ensure flawless stability during high-accuracy ball attach operations.
Ultra-precise fine pitch control across X, Y, Z, and θ axes—engineered for 10 µm resolution per division.
Featuring the patented S-Flexi Edge Clamp and One-Touch Stencil Clamp Set—engineered for precise handling of square and rectangular package substrates.
Engineered with a preselect position guide and precision-engraved text, enabling seamless setup for a wide range of components and package types during clamping operations.
Ideal for solder paste printing & BGA attach applications—optimized for ABF, BT, interposer, FR-4, and ceramic package substrates.
Proven on AI, 5G, and interposer substrates—engineered for R&D and tailored to low- to medium-volume production with precision and reliability.

Designed to meet stringent IPC standards, ensuring superior accuracy and reliability in ball attach processes. * Base on Lab test result - Precision ball height measurements, expertly extracted with Keyence Vision Measurement post-reflow, delivering consistent and reliable process validation. **

Technical Data.

Features	Specifications
Substrate/Component Size	20mm x 20mm to 110mm x 110mm (Square & Rectangular shape). For extra large components – 120mm x 120mm up to 150mm x 150mm (optional clamper jaw set required).
Substrate/Component Thickness	0.6mm to 3.0mm - Special holder upon request (Up to 8.0mm)
Quick Snap Stencil Clamp Set 1	For Flux or Solder Paste A support template is required for stencil support on substrates ranging from 80mm to 150mm in size.
Quick Snap Stencil Clamp Set 2	For Solder Ball A support template is required for stencil support on substrates ranging from 80mm to 150mm in size.
Stencil by (OEM) *TCS will provide the footprint template drawing	Up to 0.20mm thick (maximum)
UPH	10pcs to 30pcs (Depend on Components size) Actual performance on Substrate 34mm x 40mm @ 2016 BGA Ø0.5mm = 5,000pcs per month 2 manpower 30 to 40 UPH UPH for 152 mm × 152 mm X-LARGE BGA placement (printing and BGA attach): 30 minutes per unit.
XYZ Axis Precision Manual Adjustment	Travel Distance +/-10mm I 10 Micron per division - Micrometer Type
XYZ Axis Travel Accuracy	Straightness - 3 Micron I Motion Parallel - 15 Micron I Pitching 25” I Yawing 15” I Parallelism - 40 Micron
Rotary Axis Precision Manual Adjustment	Travel Distance +/-10 degree I Resolution 1’12” I 10 Micron per division - Micrometer Type
Rotary Axis Travel Accuracy	Straightness - 3 Micron I Motion Parallelism - 50 Micron
Magnifying Lense (Optional)	10X - Ø150mm with LED light

TCS – Our Community Said.

We deal with complex interposer substrates for 5G applications, and the precision offered by this system ensures our process validation—especially with the Keyence Vision integration—is consistently accurate and reliable.

— Tamba Trading Co., Ltd. Ken Tamba
The S-Flexi Edge Clamp and the vibration-damping material provide incredible stability during ball attach operations. It has seamlessly integrated into our low-to-medium volume production line while meeting all IPC standards.

— Y. Hachisuka

Frequently Ask Question.

What are the primary applications for this system?

Ideal for solder paste printing and BGA attach applications - optimized for ABF, BT, interposer, FR-4, and ceramic package substrates.

What is the maximum substrate size the machine can handle?

20 mm x 20 mm to 110 mm x 110 mm (square and rectangular shapes). For extra-large components: 120 mm x 120 mm up to 150 mm x 150 mm (optional clamper jaw set required).

How precise is the manual adjustment for the XYZ axes?

Ultra-precise fine-pitch control across X, Y, Z, and θ axes - engineered for 10µm resolution per division.

What kind of production volume is this system designed for?

10 pcs to 30 pcs UPH (depending on component size).

Actual performance:
For a 34 mm x 40 mm substrate with 2016 pcs BGA ø0.5 mm: approximately 5,000 pcs per month, with 2 operators achieving 30 to 40 UPH.

UPH for 152 mm x 152 mm extra-large BGA placement (printing and BGA attach):
Approximately 30 minutes per unit.

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